New Products
NXP Delivers Breakthrough 0.37-mm Ultra-Flat Package with Schottky Rectifiers up to 1.5A
| Application: | |
| Data Sheet: | |
| Search Parts: | |
| Contact Technical Team: |
NXP Semiconductors announced a major new benchmark in miniaturization with the launch of its next-generation family of low VF Schottky rectifiers targeting the mobile device market.
With a typical thickness of just 0.37 mm and an outline of 1.6 x 0.8 mm, the new DFN1608D-2 (SOD1608) plastic package is the smallest on the market that is capable of carrying a current of up to 1.5A. The
DFN1608D-2 has been released with a portfolio of six Schottky Barrier rectifiers: three 20V types optimized for very low forward voltage and three 40V types optimized for very low reverse current.
Average forward current ranges between 0.5 and 1.5A.
DFN1608D-2 has been released with a portfolio of six Schottky Barrier rectifiers: three 20V types optimized for very low forward voltage and three 40V types optimized for very low reverse current.
Average forward current ranges between 0.5 and 1.5A.
Disclaimer: Information and documents provided in this web site are provided "as is" without any warranty. Arrow Asia Pac uses reasonable efforts to include accurate and up-to-date information in this web site. It does not, however, make any representations as to its accuracy or completeness. Arrow Asia Pac and the other parties involved in creating and delivering these contents are not liable for any damages arising from use of this site.


